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双酚 A 环氧 Resin EP-A-3179C

Bisphenol A Epoxy - General PurposeBrandCCP CompositesGradeEP-A-3179C
Bisphenol A epoxy general-purpose resin from CCP Composites, with typical applications in carbon fiber prepreg, electronic encapsulation, and structural bonding.
Technical parameters
Manufacturer-stated data
Value
Heat deflection temp.97°C
Density1.23 g/cm³
Elongation at break2.4%
Flexural modulus3.3 GPa
Tensile strength72 MPa
Water absorption0.08%
Flexural strength137 MPa
Applications
Carbon fiber prepregElectronic encapsulationStructural adhesive bonding