English2016Cited 15

High-performance bismaleimide resins with low cure temperature for resin transfer molding process

Ping Liu, Chunyan Qu, Dezhi Wang, Ming Zhao, Changwei Liu

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Vol / issue / pages29 / 3 / 298-304

DOI10.1177/0954008316642278

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High-performance bismaleimide resins with low cure temperature for resin transfer molding process | getfrp